What's the technical requirements of the Titanium base plating platinum?
Titanium base plating platinumelectrode is the use of special plating process, on the surface of the titaniumsubstrate that through specialized processing platinum plating, can allplatinum plating or local platinum plating, more can platinum plating ontitanium package composite materials such as copper. Product surface is silverywhite, with uniform fine coating, combined with the strong, large outputcurrent, long life and other advantages.
Mainly used in: electroplating,biomedical, chemical synthesis, cathodic protection and other fields.
Base material: level of pure titanium TA1 GR1 The working current range: < 15000 a / ㎡ Working temperature: < 85 ℃ Plating metals: 99.99% Pt Platinum content: 22.45 g / ㎡ / u m Platinum layer thickness: 0.1 to 15 u m Products shape: network, plate, pipe, bar, etc Using the environment: PH: 0 to 14 Use instructions: prevent hard scratch, stopusing are taken from the electrolytic cell, the surface of the water, drystorage. Current, the greater the shorter service life, containing fluorineions in a solution of using, will quickly damage the electrode.
We produce titanium coated platinum electrode,using high temperature coating. Shape is diverse, platinum content is 12 g / ㎡ / u m, platinum layer thickness 0.2- 5 u m. Titanium plate electrode is mainly used inhigh current environment local conductive contact (such as: galvanized steelplate, PS version, etc.), acid, alkaline ionized water making, etc.